Samsung to manufacture IBM’s new processor chip
This file photo taken Aug. 29, 2019, shows Samsung Electronics Co.'s outdoor sign at the company's office building in Seoul. (Yonhap). Sketched by the Pan Pacific Agency.
SEOUL, Aug 17, 2020, Yonhap. International Business Machines Corp. said Monday that it has unveiled a new processor chip for enterprise hybrid cloud computing and that the chip will be manufactured by Samsung Electronics Co, Yonhap News Agency reported.
In a statement, the U.S. technology giant said the POWER10 chip is designed by IBM and will be made by Samsung’s 7-nanometer manufacturing technology.
“Samsung Electronics will manufacture the IBM POWER10 processor, combining Samsung’s industry-leading semiconductor manufacturing technology with IBM’s CPU designs,” IBM said in the statement.
The new chip is IBM’s first commercialized processor built using 7-nanometer process technology, it said.
IBM said it has been in partnership with Samsung on research and development for more than a decade.
Manufacturing IBM’s processor chip is expected to help Samsung achieve its target of challenging rivals such as Taiwan’s TSMC and U.S. Qualcomm in the global non-memory chip market.
Last year, Samsung announced a plan to invest 133 trillion won (US$115.7 billion) by 2030 to expand its non-memory and foundry business to take the top spot in the high-tech industry.
The world’s largest memory chipmaker also unveiled measures to develop the semiconductor ecosystem with increased investment for the foundry and non-memory segment to diversify its portfolio.
The investment will be composed of 73 trillion won for local research and development and 60 trillion won for production infrastructure, it said.
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